Papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, optoelectronic, and photonic components, devices, and systems.
| YEAR | Impact Factor |
|---|---|
| 2024-25 | 2.3 |
| 2023 | 2.2 |
| 2022 | NA |
| 2021 | NA |
JOURNAL OF ELECTRONIC PACKAGING, 1043-7398, ASME, Computer Science,Engineering,Materials Science.